MCIO Wire Preparing Automated Line
This line integrates multiple stations including manual loading table, lifter, UV laser stripping, aluminum foil swing, aluminum foil remove, CO2 laser stripping, dielectric remove, conductor pre-forming, and conductor final-trimming, enabling automated wire preparing of high-speed cables.
Request Quote Online
Fill in the information below, we will provide you with a professional quotation within 24 hours
Contact Information
Service Commitment
- 24-hour quote response
- Free technical solution design
- On-site demonstration and training
- One-year warranty, lifetime maintenance
Related Product Recommendations
CDFP Wire Preparing Automated Line
This line integrates multiple stations including manual loading table, lifter, UV laser stripping, aluminum foil swing, aluminum foil remove, CO2 laser stripping, dielectric remove, conductor pre-forming, conductor final-trimming, and automatic soldering, enabling automated wire preparing and soldering of high-speed cables.
External High-Speed Cable QSFP-DD Cable Preparing Automated Line
This line integrates stations including manual loading table, lifter, UV laser stripping, aluminum foil swing, aluminum foil remover, CO2 laser stripping, dielectric remover, conductor pre-forming, and conductor final-trimming to achieve automated wire preparation of high-speed cables.
Desktop Jetting Vision Dispensing Machine
This equipment integrates two core systems: high-precision dispensing and intelligent vision positioning. It employs a local vision CCD positioning system capable of rapidly capturing workpiece features to achieve simple yet precise positioning. Simultaneously, the integrated non-contact high-precision dispensing system excels at performing precise dispensing within minute gaps. It can stably achieve an ultimate process capability with a minimum dispensing diameter of 0.3 mm and a finest line width of 0.35 mm, perfectly meeting the stringent requirements for minute amounts of glue in microelectronics assembly.
