Fully Automatic Series
Automated Assembly Equipment
1.2 m/0.8 m Standardized Platform
Definition of Standardized Platform
This highly adaptable cable automation platform establishes a new benchmark for manufacturing through five pillars of standardization:
1. Equipment Dimensions Standardization (L×W×H): 1.2 m*1.2 m*1.9 m/0.8 m*1.2 m*1.9 m.
2. Electrical Control System Platformization: With unified PLC/IPC platform, standard I/O interfaces and communication protocols, modules are plug-and-play, and program recipes can be recalled with a single click, significantly reducing debugging time.
3. Mechanical Interface Platformization: All functional modules (pay-off, lacing, soldering, etc.) adopt unified mechanical interfaces and quick-change mechanisms for rapid mounting, dismounting, and function switching.
4. Process Platformization: Covers the complete process chain including aluminum foil stripping, insulation remove, soldering, and glue dispensing. Modules can be flexibly combined to match diverse product process requirements.
5. Safety Protection Standardization: Adopts unified physical guarding standards along with certified, compliant safety electrical components.
Fully Automatic CDFP High-Speed Cable Assembly Line
This state-of-the-art production line seamlessly integrates multiple stations, including automatic wire feeding & cross-wiring, UV laser aluminum foil stripping & swinging, aluminum foil remove, CO2 laser insulation stripping, insulation remove, pre-forming & final-trimming, Hot Bar soldering, an automatic clamp & fixture reflow system, and full MES integration.
Engineered for next-generation CDFP cable automation, this line utilizes high-precision servo systems and vision guidance to guarantee absolute assembly stability, significantly eliminating redundant operator movements while achieving true data-driven production.
Fully Automatic Izumi High-Speed Cable Assembly & Soldering Line
This modular, flexible automated line seamlessly integrates all processes – wire pay-off, lacing, aluminum foil stripping & remove, insulation stripping & remove, wire forming & trimming, soldering, and UV glue dispensing & curing. It is specifically engineered as a state-of-the-art automatic wire harness assembly line for the end-to-end processing of shielded/aluminum foil wire harnesses, coaxial cables, electronic lead wires, and ribbon cable assemblies.
Through a standardized platform and modular architecture, the line enables rapid changeovers, flexible manufacturing, and high equipment reuse rates—significantly boosting productivity, reducing labor dependency, and effectively conquering high-mix, low-volume market challenges.
Fully Automatic MCIO High-Speed Cable Wire Preparing & Hot Bar Soldering Line
This automatic wire preparing line integrates multiple stations, including a manual loading table, lifter, UV laser stripping, aluminum foil swing, aluminum foil remove, CO2 laser stripping, dielectric remove, conductor pre-forming, conductor final-trimming, and hot bar soldering. It delivers an end-to-end solution perfectly optimized for MCIO cable automation and high-precision automated hot bar soldering.
Fully Automatic NearStack Connector Assembly Line with Inspection System
This is an integrated, full-process intelligent production line specifically engineered for high-speed connector manufacturing, focusing on NearStack series connectors and cable assemblies. It achieves high-speed and high-precision production across key processes including Wafer assembly, wire preparing, laser welding, shielding plate assembly, automated unloading, serving as a core cable assembly automation equipment for AI servers, data centers, and high-speed communication equipment, and other related fields.
Fully Automatic OSFP Connector Assembly, Inspection & Packaging Line
This state-of-the-art automatic connector assembly line is specifically engineered for board-mount high-speed connectors. It integrates a complete set of precision processes, including carrier tape welding & cutting, tie-bar cutting, shield plate welding, Wafer bending, automated assembly of four distinct Wafers, final inspection, and packaging.
Enabling full-process OSFP connector automation from raw components to finished products, this line delivers a high-efficiency, high-precision intelligent manufacturing solution for the high-speed interconnect sector.