Semi-Automatic Series

This high-precision 3D vision soldering machine employs an advanced 3D vision system to precisely locate PCB solder pads and conductors, calculates positional deviations in real time, and feeds the data back to the main control system. Based on the correction data, the soldering module, combined with a specially designed thermode, performs self-adaptive alignment to ensure the conductor accurately contacts the pre-tinned solder pad.

This advanced PGRS soldering equipment supports both vision-guided alignment and pre-tinned soldering processes, enabling fast, reliable connections even under high-current conditions.

This equipment is a high-precision hot bar soldering machine integrating advanced pulsed heating technology with a precision temperature control system. Featuring a dual-soldering module design, it achieves XYZ-axis motion control driven by servo motors and precision lead screws, ensuring high positioning accuracy. With thermocouple closed-loop feedback and segmented temperature control technology, the precision soldering system delivers precise, controllable soldering temperatures and localized instantaneous heating, effectively protecting surrounding components from thermal damage. It is capable of soldering large-area PCBs or multiple products in a single cycle, significantly improving soldering efficiency, while ensuring excellent solder joint consistency, eliminating cold solder joints, thereby greatly reducing rework rates.

This series of high power hot bar soldering platforms effectively addresses industry challenges regarding wide soldering areas and uneven heat distribution for PCIe components in the high-speed cable sector. Through structural optimization and precise control of local resistance of the thermode, it significantly improves thermal balance across wide surfaces, achieving uniform results in a single cycle.

Engineered as a high-efficiency pcie connector soldering machine, this solution eliminates the need for investing in multiple machines while boosting soldering efficiency and process consistency. It serves as the ideal pcb hot bar soldering machine for the volume production of large-format circuit boards such as PCIe and CEM.

This series of high-precision desktop hot bar soldering machine delivers an efficient single-pass multi-pin automatic soldering machine solution. Built on a desktop soldering platform, it is compatible with multiple auxiliary functions including a CCD for magnified display and an automatic solder wire feeder.

The equipment is easy to operate and requires no specialized training—operators only need to place the workpiece on the soldering platform and press the start button to complete the soldering process. Its process principle involves rapid heating and cooling of solder joints under pressure, effectively preventing defects including solder floating and pseudo soldering. By integrating functions of closed-loop temperature feedback control and real-time pressure monitoring, the system enables high-precision control of soldering parameters, thereby ensuring excellent process repeatability and consistent high-quality production.

This equipment is suitable for single-sided processing of a single workpiece, soldering all solder joints on one side in a single operation.

This high-performance desktop glue dispensing machine achieves precise three-axis (XYZ) positioning control by using a motor to drive the disoensing valve module along the X/Z axes while coordinating the base movement in the Y direction.
Engineered as a highly adaptable automatic glue dispenser, the system can be configured with either a pneumatic dispensing valve or a piezoelectric valve. For applications requiring ultra-high accuracy, an optional vision positioning system can be seamlessly integrated to meet diverse production demands.

Widely Applied In: LED lighting & luminaires, automotive components, digital products, optical lenses, wire harness assembly, semiconductor packaging, and other high-precision manufacturing fields.

Application Scenarios: UV-curable acrylic dispensing / Solder paste dispensing.

This high-performance desktop jet dispensing machine seamlessly integrates two core systems: high-precision dispensing and intelligent vision positioning. It utilizes a localized CCD vision positioning system capable of rapidly capturing workpiece features to achieve rapid, precise positioning.
Simultaneously, the integrated non-contact micro glue dispensing system excels at executing precise dispensing within ultra-narrow gaps. It stably delivers an ultimate process capability with a minimum dot diameter of 0.3 mm and a line width of 0.35 mm, perfectly satisfying the stringent requirements for low-volume glue control in microelectronics assembly.